Membrana termica 8" x 12" x 2mm

Typical Applications Include:

• Telecommunications

• Computer and peripherals

• Power conversion

• RDRAM™ memory modules / chip scale packages

• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader

Gap Pad 1500 has an ideal filler blend that

gives it a low-modulus characteristic that

maintains optimal thermal performance yet

still allows for easy handling.The natural tack

on both sides of the material allows for

good compliance to adjacent surfaces of

components, minimizing interfacial resistance.